The Quantum Technology Packaging Challenge.

The packaging of quantum technologies will require development and innovation in a range of fields. In decreasing the level of human monitoring, packaging may entail the creation of streamlined, custom and fast control electronics, automation, or the refinement of highly specialized instrumentation. Resizing and scalability assessments will define what miniaturization is possible. In addition, quantum-primitive systems will require environmental shielding, for example to ensure the stability of multiple sophisticated laser systems or to maintain extreme temperature gradients. Yet despite these demanding requirements, the packaging of such systems needs to go hand in hand with cost minimization.

The challenge of successfully packaging such technology can actually drive innovation which itself can enable advancements in the quantum domain. For example, a recent effort to integrate control electronics within the ultra-cold dilution refrigerators used for superconducting qubits has resulted in a novel cryogenic-compatible control circuit that is potentially transformational for scaling these systems to greater numbers of qubits.

量子技術封裝挑戰。量子技術的封裝需要一系列領域的發展和創新。在降低人工監控等級時，包裝可能需要創建精簡、客製化和快速的控制電子設備、自動化設備或改進高度專業化的儀器。調整尺寸和可擴展性評估將決定何種程度的小型化是可能的。此外，量子原始系統將需要環境屏蔽，例如以確保多個複雜雷射系統的穩定性或維持極端的溫度梯度。儘管有這些嚴格的要求，但此類系統的封裝仍需要與成本最小化相結合。

成功封裝此類技術的挑戰實際上可以推動創新，而創新本身可以推動量子領域的進步。例如，最近人們致力於將控制電子設備整合到用於超導量子位元的超冷稀釋製冷機中，產生了一種新型的低溫相容控制電路，這種電路有可能將這些系統擴展到更多的量子位元。

Source: www.ttp.com